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A semiconductor device uses dissimilar materials in contact with each other for a variety of reasons. The thermal performance is sacrificed in order to obtain adequate thermal performance.Ī typical semiconductor device has two dissimilar materials in contact with each other. Unfortunately, the design of the semiconductor package is modified to facilitate adequate thermal dissipation. To achieve adequate thermal dissipation from the semiconductor package, a large interface area between the floating interconnect metal and the semiconductor substrate is required. The contact area of the contact is small and contact resistance is large. In a typical semiconductor fabrication process, the floating interconnect metal level is formed prior to the formation of the contacts and vias that connect the various circuit elements. In typical technologies, the thermal paths are formed by a so-called, xe2x80x9cfloatingxe2x80x9d interconnect metal level. The development of superior thermal paths has been a concern in the art. The dissipation of heat requires additional thermal paths to dissipate heat effectively.
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